SAE J1752-3:2017 pdf free

SAE J1752-3:2017 pdf free.Measurement of Radiated Emissions from Integrated Circuits
Refer to Figure 4. This PCB includes a ground plane layer that completes the TEM or GTEM cell wall over the port opening. The periphery of this ground plane layer is tinned to facilitate contact to the edge of the wall port cut in the top or bottom of the test cell. The IC side of this PCB (the side that faces in to the test cell) shall be common with the cell wall ground plane layer except for the IC being evaluated and the narrow strip of vias around the IC. Any other conductors on this surface may act as additional radiators. The access wiring and other required components (such as crystals) shall be on or connected to the support side of this PCB (the side that faces out from the TEM or GTEM cell). Power bypass capacitors for the IC are to be chosen according to manufacturers’ recommendations and located to minimize lead length (refer to Table 1). All wiring should be as short as possible and have controlled orientation relative to the PCB. The PCB material shall be compatible with the frequency range being evaluated. In theory, any size or shape of PCB may be used that will mate with the wall port on the test cell used. However, the development of this procedure was with a nominal 101 mm square PCB and a mating square wall port (refer to Figures 1, 2, and 3). A description of the test board set-up (photo or artwork, schematic, and parts list) shall be included with the test report.
Measure ambient levels to assure that any ambient signals present are at least 6 dB below the target reference level (see Appendix D). This is accomplished by placing the IC mounted on the IC test PCB in the measurement position on the TEM or GTEM cell wall port with the test board not powered but with all other instrumentation and support equipment active and measuring the detected ambient level with the spectrum analyzer. The ambient data shall be a part of the test report. If the ambient is excessive check the integrity of the overall system, especially the interconnecting cables and connectors.If necessary, use a shielded enclosure, a lower noise preamplifier or a narrower spectrum analyzer resolution bandwidth.SAE J1752-3 pdf free download.